Malaysia’s data centre pipeline has surged to nearly 13 gigawatts (GW)—larger than Indonesia, Thailand, and Singapore combined—and is projected to reach US$16.02 billion by 2031 at a 19.55% CAGR.
Riding on these new developments, Panduit has introduced a suite of new infrastructure solutions designed to support Malaysia’s rapidly expanding data centre and enterprise sectors, as the country positions itself as a regional hub for AI and cloud computing. Three new offerings include the EL2P Intelligent Power Distribution Unit, Gen 7 SAN Director Connectivity, and the Fault Managed Power System (FMPS).
As facilities grapple with rising rack power density, cooling limitations, and scalability demands, Panduit’s FMPS and EL2P address these pressures by providing intelligent power distribution for high-density environments, while Gen 7 SAN Director Connectivity delivers scalable, GPU-ready fibre architectures.
“Malaysia’s success in the AI era will not be measured only by how much digital investment we attract, but by the strength of the ecosystem we build around it — the infrastructure we develop, the capabilities we cultivate, and the partnerships we forge,” said YBrs. Puan Zuaida Abdullah, deputy chief executive officer (Investment Development) at the Malaysian Investment Development Authority (MIDA), who officiated the event.
The timing aligns with explosive global AI adoption. According to Grand View Research, the generative AI market is forecast to grow from US$29.6 billion in 2026 to US$324.7 billion by 2033, at a CAGR of 40.8%, driven by demand for AI copilots, virtual assistants, and workflow modernisation across industries.
“According to Grand View Research, global AI adoption is growing at CAGR of 40%, and AI is reshaping how organisations operate. Companies in Malaysia need to consider that AI is revolutionising efficiency across industries, such as automated warehouses and smart buildings,” said Simin Sirun, business director for ASEAN, India, and Korea at Panduit.
Panduit also expanded its AI infrastructure readiness with a next-generation Very Small Form Factor (VSSF) fibre optic portfolio, featuring MMC connectivity and shuffle cables engineered to support advanced AI GPU architectures, including NVIDIA Vera Rubin. The VSSF range delivers higher fibre density and performance optimised for AI environments, helping meet the scalability requirements of next-generation computing.
Panduit says three infrastructure domains underpin modern digital environments:
In electrical infrastructure, best practices in grounding and bonding, H-Tap connections, and cable cleat systems were showcased as core elements of resilient electrical design for high-density AI data centres and industrial facilities.
In enterprise network infrastructure, sessions explored extended-reach solutions beyond standard 100-metre limits, high-performance copper cabling, intelligent cabinet designs, and the newly launched FMPS, which forms the foundation of safety, reliability, and compliance in critical environments.
For data centre network infrastructure, presentations examined how increasing fibre density and AI-driven workloads are reshaping design requirements.
Topics included structured cable routing, advanced power distribution approaches like the EL2P to improve network consistency and operational efficiency, fibre management, pre-terminated connectivity such as Gen 7 SAN Director Connectivity, and scalable architectures enabling high-density, GPU-ready, AI-capable deployments.
Panduit’s solutions are backed by its Johor Bahru manufacturing facility, which commenced operations in October 2023 and serves as a regional supply chain hub. Equipped with advanced robotics, automation, and energy-efficient design, the plant supports Malaysia’s New Industrial Master Plan 2030 (NIMP 2030) and has created over 200 jobs in engineering, technical, and production roles.
