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Home Technology Cloud and Platforms

New solution to better cool hot AI DCs

FutureIoT Editors by FutureIoT Editors
April 17, 2025
Photo by panumas nikhomkhai: https://www.pexels.com/photo/network-rack-17323801/

Photo by panumas nikhomkhai: https://www.pexels.com/photo/network-rack-17323801/

The global data centre market is booming, driven by soaring data consumption and AI adoption, with a projected CAGR of 12% over the next decade. KPMG says Asia Pacific is surging ahead of other markets with places like Hong Kong and Singapore are already thriving, while emerging hubs like Thailand and India are rapidly catching up.

The expansion of AI and HPC capabilities in Asia necessitates advanced thermal management solutions that can cope with rising heat densities.

To address the growing need for effective cooling of these data-intensive environments, is a new high-density heat rejection system designed to support AI (artificial intelligence) and HPC (high-performance computing) applications.

Meeting the demands of AI and HPC

The Vertiv CoolLoop Trim Cooler integrates with both air and liquid cooling systems, making it adaptable to various climate conditions across the region. Cheehoe Ling, vice president of Product Management at Vertiv, highlights the importance of innovative cooling solutions that can handle high heat densities while improving energy efficiency.

Energy efficiency and space savings

A key feature of the CoolLoop Trim Cooler is its potential for significant energy savings, with the system capable of reducing annual cooling energy consumption by up to 70% through the use of free cooling and mechanical operation. This is particularly relevant for COOs aiming to enhance operational efficiency while also meeting sustainability targets.

Additionally, the system provides a 40% reduction in space requirements compared to traditional cooling solutions, allowing companies to optimise their data centre layouts.

Compliance with future regulations

With environmental regulations becoming increasingly stringent, the CoolLoop Trim Cooler is designed to comply with the upcoming EU F-GAS regulations set for 2027. This proactive approach helps businesses avoid costly redesigns and infrastructure upgrades in the future. The use of low-GWP (Global Warming Potential) refrigerants further reflects a commitment to sustainability, aligning with the growing focus on environmental responsibility.

Simplifying installation and operations

Operational complexity is a significant concern for users of compute technology services as well as providers of such services. Vertiv claims its offering simplifies installation with straightforward water connections and compatibility with various cooling environments. This ease of integration saves time and reduces costs, enabling organisations to focus on core operations rather than complicated setups.

Related:  State of IoT deployment and what to do next in 2023
Tags: data centre coolingKPMGVertiv
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Asia’s ONLY dedicated IoT publication

The race to harness the power of Internet of Things (IoT) is here. FutureIoT is dedicated to individuals, as well as public and private organizations looking to tap the potential of IoT to transform the way we live, work and do business. FutureIoT is the dedicated media that provides the single source of truth about IoT, the technology, its application and regulation, originating from Asia. << Read more >>

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