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Home Technology Networking

Chip to enable ultralow-power IoT connectivity

FutureIoT Editors by FutureIoT Editors
September 19, 2022
Photo by Craig Dennis: https://www.pexels.com/photo/green-and-grey-circuit-board-57007/

Photo by Craig Dennis: https://www.pexels.com/photo/green-and-grey-circuit-board-57007/

The technology-research organisation, CEA and satellite IoT network operator Astrocast, announced their successful collaboration on a low-cost, bidirectional communication module that enables corporations to communicate with their remote assets in areas not covered by terrestrial networks.

Based on a new architecture developed by CEA-Leti, the module’s L-band chip is a key hardware component that enables Astrocast customers to cost-efficiently communicate with their assets in the field via its network.

It was completed earlier this year in an expedited project between the research institute and Astrocast, and is embedded in Astrocast’s RF module, called Astronode S.

The chip’s architecture is split over the RF core and digital processing and control units. It is fully optimised to support Astrocast’s dedicated bidirectional ground-to-satellite protocol and provides an optimal trade-off between link budget and low-power and low-cost constraints.

The chip also embeds all low-earth orbit (LEO), satellite-specific features such as satellite detection and robustness to Doppler shift.

The miniaturised, surface-mount module communicates with terrestrial devices via Astrocast’s constellation of LEO satellites. Using the L-band spectrum, the network primarily targets maritime, oil & gas, agriculture, land transport and environmental applications in which ubiquitous coverage is required.

Laurent Vieira de Mello

“Terrestrial IoT networks cover only about 15% of the planet, which leaves vast remote and rural areas where our global satellite network provides coverage that is crucial for our target markets,” said Laurent Vieira de Mello, Astrocast’s COO.

“Leveraging its expertise embedded in a preliminary version of the RF chip, CEA-Leti developed its chip and delivered the final prototype to meet our requirements and time-to-market goals.”

“They managed the chip technology transfer to our industrialisation, qualification and production partner,” he continued.

The project’s critical time-to-market window was managed through a flexible collaboration model covering both prototype and industrialization phases.

CEA-Leti’s industrial tester used for characterisation was key to accelerating from prototype to production, which enabled prototype characterisation in parallel on the tester and in the lab, Durr explained.

Michael Durr

“This process provided a short-loop debug capability with all skills available at CEA-Leti, and enabled us to deliver fully validated inputs to Astrocast’s industrialization partner for an easier industrial test-program development,” said Michel Durr, business development manager at CEA-Leti.

The low-energy, compact, surface-mount Astronode S module for highly integrated, battery-powered IoT systems offers a total cost of ownership up to three times lower than traditional satellite IoT alternatives.

Related:  Inmarsat’s new satellite to enable IIoT deployments
Tags: AstrocastCEAL-band chipLow Earth Orbitlow-orbit satellites
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